Company Profile

About ZIHETECH

ZIHETECH Semiconductor Technology

Jiangsu ZIHETECH Semiconductor Technology Co., Ltd.

Founded in 2014 and located in Qidong City, Jiangsu Province, China. The factory spans 15,000 sqm and is equipped with advanced equipment including German Trumpf TruLaser fully automated laser cutting center, AMADA CNC bending machines, 3-axis CNC machining centers, and a clean welding workshop. We specialize in the design and manufacturing of semiconductor equipment racks, structural components, and precision parts with tolerances up to ±0.02mm, widely used in integrated circuits and compound semiconductors.

The company has a comprehensive quality management system, equipped with Zeiss CMM and other precision inspection equipment, achieving a product outgoing qualification rate of ≥99.5%. Leveraging our one-stop manufacturing capabilities from design to machining, inspection, and surface treatment, we provide customized semiconductor equipment support solutions.

Semiconductor Equipment Racks Precision Sheet Metal CNC Precision Machining Clean Welding

Quality First · Innovation Driven www.zihejs.com

2014Company Founded
17Years Industry Experience
75Employees
40+Customers Served
Equipment & Precision

Core Equipment & Manufacturing Precision

Equipped with German Trumpf TruLaser cutting center, AMADA CNC bending machines, and more for high-precision, high-cleanliness semiconductor equipment manufacturing

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Laser Cutting Center

Trumpf
ModelTruLaser 5030
Cutting Range3000×1500 mm
Thickness0.5 ~ 25 mm
Machine Accuracy±0.02 mm
Product Tolerance±0.05 mm
MaterialsSUS304/316L, 6061/5052 Aluminum, TC4 Titanium
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CNC Machining Centers

3-Axis / 5-Axis / Large Structure
Travel4000×3000×1200 mm
Machine Accuracy±0.01 mm
Product Tolerance±0.02 mm
ApplicationsSemiconductor racks, chambers, large frame structures
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CNC Bending Center

Trumpf
Bending Length4000 mm
Thickness0.2 ~ 16 mm
Machine Accuracy±0.05 mm
Product Tolerance±0.08 mm
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Clean Assembly Workshop

Class 10000 / Assembly + Welding
CleanlinessClass 10000
OperationsRack assembly, module assembly, final inspection
Welding MethodsTIG welding, laser welding
StandardMeets cleanroom production requirements
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Precision Inspection

Full-Process Quality Assurance
CMM Inspection±0.002 mm
2D/3D ProjectionFast profile inspection
Qualification Rate≥99.5%
CertificationsISO 9001 / ISO 14001 / ISO 45001
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Surface Treatment

In-House + Strategic Outsourcing
PhysicalGrinding, brushing, polishing
Powder CoatingOrange peel/textured/gloss
ChemicalAnodizing/hard anodizing/electropolishing
OutsourcedZn/Ni/Ti plating, micro-arc oxidation, PVD coating
PTFE CoatingPTFE coating (outsourced)
Company History

Company Timeline

2014

Company Founded

Established Shanghai Zihe Machinery Equipment Co., Ltd., factory area 1,200 sqm

2015

Focus on Semiconductor

Focused on semiconductor sector, launched gas cabinet products

2017

Third-Generation Semiconductor

Established precision parts processing line

2018

Relocation to Jinshan

Company relocated to Jinshan, factory expanded to 3,000 sqm

2021

Rack Business Launch

Launched semiconductor rack business

2024

Smart Factory Launch

New smart factory commissioned in Qidong, Jiangsu, 15,000 sqm

Customer Base

Customer Positioning

ZIHETECH is a precision sheet metal support service provider for semiconductor equipment, offering precision rack and structural component manufacturing to 40+ semiconductor equipment manufacturers (Tier-2 suppliers).

Direct Customers (Tier-2)

Semiconductor process equipment manufacturers
Semiconductor gas equipment manufacturers
Semiconductor equipment support providers

End Customers

Leading domestic semiconductor equipment makers
(NAURA, AMEC, ETERNAL, Piotech, Kingsemi, etc.)
Japan & Taiwan market end users
(Tokyo Electron, DISCO, Advantest, etc.)
IC and compound semiconductor Fabs

Intellectual Property

Patents & Technology

19 Total Patents
2 Invention Patents
17 Utility Model Patents
Invention Patent

Semiconductor Frame Core-Bonding Device and Method

A semiconductor frame core-bonding device and method achieving high-precision bonding and improved production efficiency

CN118866720B2024
Invention Patent

Semiconductor Frame Feeding Device and Method

A feeding device and method for semiconductor frame production, optimizing material handling processes

CN118874878B2024
Utility Model

Sheet Metal Grinding Equipment

Precision sheet metal grinding device improving surface treatment quality and processing efficiency

CN219925431U2023
Utility Model

Sheet Metal Drilling Machine

High-efficiency precision sheet metal drilling equipment improving drilling accuracy and speed

CN219925195U2023
Utility Model

Sheet Metal Punching Machine

High-precision sheet metal punching equipment for fast and accurate press forming

CN219925351U2023
Utility Model

Sheet Metal Rack

Optimized rack structural design for easy transportation and installation, reducing logistics costs

CN219926012U2023
Utility Model

Sheet Metal Polishing Machine

Automated sheet metal polishing equipment improving surface finish and consistency

CN219925618U2023
Utility Model

Sheet Metal Spraying Equipment

Precision spraying system for uniform coverage and improved coating quality

CN219923434U2023
Utility Model

Sheet Metal Cutting Equipment

High-precision cutting equipment for fine blanking and complex shape processing

CN219925197U2023
Certifications

Certifications

ISO

ISO 9001:2015

Quality Management System

ISO

ISO 14001:2015

Environmental Management System

ISO

ISO 45001:2018

Occupational Health & Safety